INERTIAL SENSOR MODULE

PROBLEM TO BE SOLVED: To prevent peeling of a piezoelectric vibration element caused by impact, regarding an inertial sensor module. SOLUTION: The module has a constitution including: an inertial sensor constituted of the tuning fork-shaped or H-shaped piezoelectric vibration element, an element loa...

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Bibliographische Detailangaben
1. Verfasser:	IBUSUKI KATSUHIDE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION OF NOISE BY SUCH CIRCUITS GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER GYROSCOPIC INSTRUMENTS IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MEASURING MEASURING DISTANCES, LEVELS OR BEARINGS NAVIGATION PHOTOGRAMMETRY OR VIDEOGRAMMETRY PHYSICS RESONATORS SEMICONDUCTOR DEVICES SURVEYING TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent peeling of a piezoelectric vibration element caused by impact, regarding an inertial sensor module. SOLUTION: The module has a constitution including: an inertial sensor constituted of the tuning fork-shaped or H-shaped piezoelectric vibration element, an element loading member having a piezoelectric vibration element loading pad on which the piezoelectric vibration element is loaded and a first external terminal, and a first lid member for maintaining the periphery of the piezoelectric vibration element in an airtight environment; a resin part comprising polyimide or silicon provided on the surface of the element loading member and the first lid member; a module member having an inertial sensor connection pad and a second external terminal electrically connected to the inertial sensor, for loading the inertial sensor thereon; and a second lid member for maintaining the periphery of the inertial sensor in an airtight environment. COPYRIGHT: (C)2011,JPO&INPIT