METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PLATING APPARATUS

PROBLEM TO BE SOLVED: To apply a plating treatment to a plurality of types of semiconductor elements formed on one semiconductor substrate, the plating treatment corresponding to each of the types. SOLUTION: The plating treatment is independently applied to the plurality of semiconductor forming are...

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Hauptverfasser:	MISAWA KAZUHIRO, FUJITA KEN, MISAWA HIROSHI, MAKINO YUTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To apply a plating treatment to a plurality of types of semiconductor elements formed on one semiconductor substrate, the plating treatment corresponding to each of the types. SOLUTION: The plating treatment is independently applied to the plurality of semiconductor forming area respectively by coming into contact with an independent plating process tool to correspond to the plurality of the semiconductor element forming areas on the semiconductor substrate where the plurality of the semiconductor forming areas are defined to correspond to the plurality of types. COPYRIGHT: (C)2011,JPO&INPIT