BONDED HONEYCOMB SEGMENT ASSEMBLY

PROBLEM TO BE SOLVED: To provide a bonded honeycomb segment assembly excellent in thermal shock resistance. SOLUTION: The bonded honeycomb segment assembly 1 is provided with a plurality of honeycomb segments 2 each having: a cell structural body having a plurality of cells 5 which are divided by po...

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Bibliographische Detailangaben
Hauptverfasser: MATSUBARA REIJI, TAKAGI TOMOYOSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a bonded honeycomb segment assembly excellent in thermal shock resistance. SOLUTION: The bonded honeycomb segment assembly 1 is provided with a plurality of honeycomb segments 2 each having: a cell structural body having a plurality of cells 5 which are divided by porous barrier walls 6 and serve as flow passages of fluid which are arranged in parallel to one another; and outer walls disposed on outer surroundings of the cell structural body, and is constituted by joining respective outer walls of the plurality of honeycomb segments 2 to one another via joint layers 9, wherein a compression Young's modulus (M1) in the thickness direction of a joint layer located near the center of gravity on a cutting surface orthogonal to passage direction of a cell and a compression Young's modulus (M2) in the thickness direction of the joint layer of joining the outer wall of a honeycomb segment located on the outermost circumstance satisfy the relation of M1