CIRCUIT BOARD
PROBLEM TO BE SOLVED: To form a connection part high in reliability of connection between conductor layers relative to a through-hole plating or the like, in a large-current circuit board including a plurality of conductor layers. SOLUTION: In this circuit board 100 including a plurality of conducto...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To form a connection part high in reliability of connection between conductor layers relative to a through-hole plating or the like, in a large-current circuit board including a plurality of conductor layers. SOLUTION: In this circuit board 100 including a plurality of conductor layers, a through-hole is formed on the circuit board 100, and a metallic self-tapping screw 200 is screwed therein. The screw thread 210 of the self-tapping screw 200 cuts into the conductor layers 111, 112, 114 to short-circuit the conductor layers to one another, whereby connection reliability among the conductor layers is improved. COPYRIGHT: (C)2011,JPO&INPIT |
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