COPPER-COATED POLYIMIDE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a copper-coated polyimide substrate, which is excellent in bending resistance, particularly, in semiconductor mounting use for mounting a liquid crystal screen driving semiconductor. SOLUTION: The copper-coated polyimide substrate includes: a metal seed layer on at least one surface of a polyimide film by sputtering or evaporation; a copper layer formed thereon; and a copper plating film formed further thereon by electric plating or by combination of electric plating and electrodeless plating. The copper plating film has a relative secondary ion intensity of sulfur of 1,000 counts or less by dynamic SIMS method. In the electric plating, an insoluble anode is used, a copper plating solution containing 0.1-10 g/L of iron ion based on the total amount is used, and the addition amount of a gloss agent to be added to replenish a decomposed content is controlled to 0.005-0.1 mg per m3of the copper plating solution and per hour in terms of sulfur. COPYRIGHT: (C)2011,JPO&INPIT