RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a cured film excellent in mechanical properties even on firing at a low temperature of not higher than 200°C. SOLUTION: The resin composition includes (a) a polyimide having an alkoxymethyl group or a methylol group, a polyben...

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Bibliographische Detailangaben
Hauptverfasser:	MINAMIHASHI KATSUYA, TOMIKAWA MASAO, BABA OSAMU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a cured film excellent in mechanical properties even on firing at a low temperature of not higher than 200°C. SOLUTION: The resin composition includes (a) a polyimide having an alkoxymethyl group or a methylol group, a polybenzoxazole, a polyamide-imide, a precursor thereof or a copolymer thereof and (b) a compound having at least two alkoxymethyl groups or methylol groups. The resin composition further contains (c) a thermal acid generator. Further incorporation of (d) a photoacid generator enables the formation of a positive-type or negative-type pattern or incorporation of (e) a compound having an unsaturated bond and (f) a photoinitiator enables the formation of a negative-type pattern. COPYRIGHT: (C)2011,JPO&INPIT