COMPOSITE MATERIAL FOR ELECTRIC AND ELECTRONIC COMPONENTS, ELECTRIC AND ELECTRONIC COMPONENTS USING THE COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING COMPOSITE MATERIAL FOR ELECTRIC AND ELECTRONIC COMPONENTS

PROBLEM TO BE SOLVED: To provide a metal resin composite material for electric and electronic components, which can maintain high adhesion between a metal base material and a resin layer even when heat treatment such as reflow is carried out, and to provide the electric and electronic components usi...

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Bibliographische Detailangaben
Hauptverfasser:	KIN YOKUN, OKAMURA HIROYO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a metal resin composite material for electric and electronic components, which can maintain high adhesion between a metal base material and a resin layer even when heat treatment such as reflow is carried out, and to provide the electric and electronic components using the composite material. SOLUTION: The composite material for the electric and electronic components has the metal base material (A) consisting of phosphor bronze, a surface treated layer (B) laminated on at least a part of the metal base material (A) surface and a thermally curable resin layer (C) laminated on at least a part of the surface treated layer (B). The surface treated layer (B) has film thickness of 30 nm or more and can be obtained by treating the metal base material (A) surface with a solution containing a specific silane coupling agent or a compound obtained by hydrolyzing the silane coupling agent. COPYRIGHT: (C)2011,JPO&INPIT