SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME
PROBLEM TO BE SOLVED: To provide a substrate cutting apparatus which can effectively and stably cut even a relatively thin glass substrate, and to provide a method of cutting a substrate using the same. SOLUTION: The substrate cutting apparatus 101 includes a stage 20 configured to support a substra...
Gespeichert in:
| Hauptverfasser: | , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | CHOI IN-SU LEE YUNG-JIN KIN SHODAI LEE HYUUUL KIM HYUNG SIK HAN GYOO-WAN KIM JUN-HYEONG PARK JIN-HAN |
| description | PROBLEM TO BE SOLVED: To provide a substrate cutting apparatus which can effectively and stably cut even a relatively thin glass substrate, and to provide a method of cutting a substrate using the same. SOLUTION: The substrate cutting apparatus 101 includes a stage 20 configured to support a substrate 10 to be cut along a virtual cutting line CL, a laser generator 30 configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator 50 disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line. COPYRIGHT: (C)2011,JPO&INPIT |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2010228005A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2010228005A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2010228005A3</originalsourceid><addsrcrecordid>eNrjZPAKDnUKDglyDHFVcA4NCfH0c1dwDAhwBAqEBis4-rko-LqGePi7KPi7weUROkKDQfwQD1eFYEdfVx4G1rTEnOJUXijNzaDk5hri7KGbWpAfn1pckJicmpdaEu8VYGRgaGBkZGFgYOpoTJQiANZMLeo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME</title><source>esp@cenet</source><creator>CHOI IN-SU ; LEE YUNG-JIN ; KIN SHODAI ; LEE HYUUUL ; KIM HYUNG SIK ; HAN GYOO-WAN ; KIM JUN-HYEONG ; PARK JIN-HAN</creator><creatorcontrib>CHOI IN-SU ; LEE YUNG-JIN ; KIN SHODAI ; LEE HYUUUL ; KIM HYUNG SIK ; HAN GYOO-WAN ; KIM JUN-HYEONG ; PARK JIN-HAN</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a substrate cutting apparatus which can effectively and stably cut even a relatively thin glass substrate, and to provide a method of cutting a substrate using the same. SOLUTION: The substrate cutting apparatus 101 includes a stage 20 configured to support a substrate 10 to be cut along a virtual cutting line CL, a laser generator 30 configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator 50 disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line. COPYRIGHT: (C)2011,JPO&INPIT</description><language>eng</language><subject>CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; GLASS ; MACHINE TOOLS ; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MINERAL OR SLAG WOOL ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20101014&DB=EPODOC&CC=JP&NR=2010228005A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20101014&DB=EPODOC&CC=JP&NR=2010228005A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOI IN-SU</creatorcontrib><creatorcontrib>LEE YUNG-JIN</creatorcontrib><creatorcontrib>KIN SHODAI</creatorcontrib><creatorcontrib>LEE HYUUUL</creatorcontrib><creatorcontrib>KIM HYUNG SIK</creatorcontrib><creatorcontrib>HAN GYOO-WAN</creatorcontrib><creatorcontrib>KIM JUN-HYEONG</creatorcontrib><creatorcontrib>PARK JIN-HAN</creatorcontrib><title>SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME</title><description>PROBLEM TO BE SOLVED: To provide a substrate cutting apparatus which can effectively and stably cut even a relatively thin glass substrate, and to provide a method of cutting a substrate using the same. SOLUTION: The substrate cutting apparatus 101 includes a stage 20 configured to support a substrate 10 to be cut along a virtual cutting line CL, a laser generator 30 configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator 50 disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line. COPYRIGHT: (C)2011,JPO&INPIT</description><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>GLASS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAKDnUKDglyDHFVcA4NCfH0c1dwDAhwBAqEBis4-rko-LqGePi7KPi7weUROkKDQfwQD1eFYEdfVx4G1rTEnOJUXijNzaDk5hri7KGbWpAfn1pckJicmpdaEu8VYGRgaGBkZGFgYOpoTJQiANZMLeo</recordid><startdate>20101014</startdate><enddate>20101014</enddate><creator>CHOI IN-SU</creator><creator>LEE YUNG-JIN</creator><creator>KIN SHODAI</creator><creator>LEE HYUUUL</creator><creator>KIM HYUNG SIK</creator><creator>HAN GYOO-WAN</creator><creator>KIM JUN-HYEONG</creator><creator>PARK JIN-HAN</creator><scope>EVB</scope></search><sort><creationdate>20101014</creationdate><title>SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME</title><author>CHOI IN-SU ; LEE YUNG-JIN ; KIN SHODAI ; LEE HYUUUL ; KIM HYUNG SIK ; HAN GYOO-WAN ; KIM JUN-HYEONG ; PARK JIN-HAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2010228005A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>GLASS</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOI IN-SU</creatorcontrib><creatorcontrib>LEE YUNG-JIN</creatorcontrib><creatorcontrib>KIN SHODAI</creatorcontrib><creatorcontrib>LEE HYUUUL</creatorcontrib><creatorcontrib>KIM HYUNG SIK</creatorcontrib><creatorcontrib>HAN GYOO-WAN</creatorcontrib><creatorcontrib>KIM JUN-HYEONG</creatorcontrib><creatorcontrib>PARK JIN-HAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOI IN-SU</au><au>LEE YUNG-JIN</au><au>KIN SHODAI</au><au>LEE HYUUUL</au><au>KIM HYUNG SIK</au><au>HAN GYOO-WAN</au><au>KIM JUN-HYEONG</au><au>PARK JIN-HAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME</title><date>2010-10-14</date><risdate>2010</risdate><abstract>PROBLEM TO BE SOLVED: To provide a substrate cutting apparatus which can effectively and stably cut even a relatively thin glass substrate, and to provide a method of cutting a substrate using the same. SOLUTION: The substrate cutting apparatus 101 includes a stage 20 configured to support a substrate 10 to be cut along a virtual cutting line CL, a laser generator 30 configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator 50 disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line. COPYRIGHT: (C)2011,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2010228005A |
| source | esp@cenet |
| subjects | CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T18%3A32%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHOI%20IN-SU&rft.date=2010-10-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2010228005A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |