SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME

PROBLEM TO BE SOLVED: To provide a substrate cutting apparatus which can effectively and stably cut even a relatively thin glass substrate, and to provide a method of cutting a substrate using the same. SOLUTION: The substrate cutting apparatus 101 includes a stage 20 configured to support a substrate 10 to be cut along a virtual cutting line CL, a laser generator 30 configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator 50 disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line. COPYRIGHT: (C)2011,JPO&INPIT