METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT

PROBLEM TO BE SOLVED: To solve the problem that displacement of a substrate due to thermal expansion may cause a main position shift although an adhesive layer is provided on a reverse surface of a semiconductor chip before die bonding and heating is carried out at a temperature of, for example, about 150°C for the die bonding while a high-precision position recognition/positioning function is needed for the die bonding since what is called a substrate article has semiconductor chips stacked and die-bonded, for example, in a staircase state in device regions in a matrix on a device mounting surface of a multilayer organic wiring board. SOLUTION: The method of manufacturing a semiconductor integrated circuit includes die-bonding semiconductor chips in a die bonding process for the substrate article after confirming that the temperature reaches a predetermined stable temperature range while monitoring positions of two points on a circuit board and also heating parts of the circuit board where the semiconductor chips are to be fitted. COPYRIGHT: (C)2011,JPO&INPIT