MASK FOR CHARGED PARTICLE BEAM EXPOSURE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a mask for charged particle beam exposure eliminating thermal deflection and displacement of a membrane due to heat storage during exposure without blocking formation of a fine mask pattern, and to provide a method of manufacturing the mask for charged particle beam...

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1. Verfasser:	ITO KOJIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mask for charged particle beam exposure eliminating thermal deflection and displacement of a membrane due to heat storage during exposure without blocking formation of a fine mask pattern, and to provide a method of manufacturing the mask for charged particle beam exposure. SOLUTION: The mask for charged particle beam exposure includes a first wafer 4 and a second wafer 1 bonded to the first wafer 4. The second wafer 1 has a mask pattern 14 for transfer formed on a top side. The first wafer 4 has a mask pattern 44 formed on a top side, and an opening 45 of the mask pattern 44 is opposed to an opening 15 of the mask pattern 14 for transfer and has a size larger than the size of the opening 15 of the mask pattern 14 for transfer. COPYRIGHT: (C)2011,JPO&INPIT