ELECTRONIC EQUIPMENT AND LIGHTING APPARATUS
PROBLEM TO BE SOLVED: To provide an electronic equipment in which heat generated in a semiconductor element is radiated through a heat sink and a lighting apparatus installed with this electronic equipment. SOLUTION: The electronic equipment 1 is equipped with a semiconductor element 2 having a body...
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| creator | IRIE RYOTA KITAMURA NORIYUKI |
| description | PROBLEM TO BE SOLVED: To provide an electronic equipment in which heat generated in a semiconductor element is radiated through a heat sink and a lighting apparatus installed with this electronic equipment. SOLUTION: The electronic equipment 1 is equipped with a semiconductor element 2 having a body part 6, a fin 7 provided on the side part 6a of the body part 6, and a lead wire 8 led out from the body part 6, a heat sink 3 in which the fin 7 of the semiconductor element 2 is soldered to a pad 10 and the semiconductor element 2 is fixed to the front face 3a side, a circuit board 4 to which the lead wire 8 of the semiconductor element is soldered, and a case 5 in which the circuit board 4 is arranged opposed to the bottom plate part 12 and the rear face 3b side of the heat sink 3 is adhered to the side plate part 13 by a thermally conductive adhesive 14. COPYRIGHT: (C)2011,JPO&INPIT |
| format | Patent |
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SOLUTION: The electronic equipment 1 is equipped with a semiconductor element 2 having a body part 6, a fin 7 provided on the side part 6a of the body part 6, and a lead wire 8 led out from the body part 6, a heat sink 3 in which the fin 7 of the semiconductor element 2 is soldered to a pad 10 and the semiconductor element 2 is fixed to the front face 3a side, a circuit board 4 to which the lead wire 8 of the semiconductor element is soldered, and a case 5 in which the circuit board 4 is arranged opposed to the bottom plate part 12 and the rear face 3b side of the heat sink 3 is adhered to the side plate part 13 by a thermally conductive adhesive 14. 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SOLUTION: The electronic equipment 1 is equipped with a semiconductor element 2 having a body part 6, a fin 7 provided on the side part 6a of the body part 6, and a lead wire 8 led out from the body part 6, a heat sink 3 in which the fin 7 of the semiconductor element 2 is soldered to a pad 10 and the semiconductor element 2 is fixed to the front face 3a side, a circuit board 4 to which the lead wire 8 of the semiconductor element is soldered, and a case 5 in which the circuit board 4 is arranged opposed to the bottom plate part 12 and the rear face 3b side of the heat sink 3 is adhered to the side plate part 13 by a thermally conductive adhesive 14. COPYRIGHT: (C)2011,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS |
| title | ELECTRONIC EQUIPMENT AND LIGHTING APPARATUS |
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