ELECTRONIC EQUIPMENT AND LIGHTING APPARATUS

PROBLEM TO BE SOLVED: To provide an electronic equipment in which heat generated in a semiconductor element is radiated through a heat sink and a lighting apparatus installed with this electronic equipment. SOLUTION: The electronic equipment 1 is equipped with a semiconductor element 2 having a body...

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Hauptverfasser: IRIE RYOTA, KITAMURA NORIYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic equipment in which heat generated in a semiconductor element is radiated through a heat sink and a lighting apparatus installed with this electronic equipment. SOLUTION: The electronic equipment 1 is equipped with a semiconductor element 2 having a body part 6, a fin 7 provided on the side part 6a of the body part 6, and a lead wire 8 led out from the body part 6, a heat sink 3 in which the fin 7 of the semiconductor element 2 is soldered to a pad 10 and the semiconductor element 2 is fixed to the front face 3a side, a circuit board 4 to which the lead wire 8 of the semiconductor element is soldered, and a case 5 in which the circuit board 4 is arranged opposed to the bottom plate part 12 and the rear face 3b side of the heat sink 3 is adhered to the side plate part 13 by a thermally conductive adhesive 14. COPYRIGHT: (C)2011,JPO&INPIT