PATTERN FORMING METHOD OF PHOTOSENSITIVE MATERIAL

PROBLEM TO BE SOLVED: To provide a pattern forming method of a photosensitive material capable of forming a thin line pattern with adhesion in short exposure time. SOLUTION: In the pattern forming method of the photosensitive material, by irradiating a photosensitive layer which comprises the photos...

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Bibliographische Detailangaben
1. Verfasser:	HIGUCHI REIJI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a pattern forming method of a photosensitive material capable of forming a thin line pattern with adhesion in short exposure time. SOLUTION: In the pattern forming method of the photosensitive material, by irradiating a photosensitive layer which comprises the photosensitive material and is formed on a substrate with exposure light such that the focus of the exposure light is positioned on the substrate side by 1 to 3 time length of the thickness of the photosensitive layer based on the surface of the photosensitive layer on the opposite side of the substrate, a pattern is formed on the substrate. COPYRIGHT: (C)2011,JPO&INPIT