STAMPER FOR IMPRINT, METHOD FOR MANUFACTURING THE SAME, AND IMPRINT METHOD

PROBLEM TO BE SOLVED: To provide a stamper for imprint which can suppress peeling of a resist film by use of the stamper for imprint having electrical conductivity, to provide a method for manufacturing the same, and to provide an imprint method. SOLUTION: The surface resistance of this stamper for...

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Bibliographische Detailangaben
1. Verfasser:	YASUDA YOSHITOMO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a stamper for imprint which can suppress peeling of a resist film by use of the stamper for imprint having electrical conductivity, to provide a method for manufacturing the same, and to provide an imprint method. SOLUTION: The surface resistance of this stamper for imprint is 1-1,000 Ω/cm2. This imprint method includes: a press-contacting step of press-contacting the stamper for imprint to a layer for shape transfer formed on a substrate; an energization step of energizing to the stamper for imprint; and a separation step of separating the stamper for imprint from the shape transfer layer. The method for manufacturing the stamper includes a step of forming a conductive film on a surface of an uneven pattern of a quartzose substrate having the uneven pattern by the physical vapor deposition method. COPYRIGHT: (C)2010,JPO&INPIT