ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of: improving heat conduction from a heating element to a heat sink in a cooling device, which cools heat generated by a semiconductor chip; and making operability at the replacement of semiconductor chips easy. SOLUTION: A holding frame body 7 is attached to a semiconductor chip 2, and the semiconductor chip 2 attached with the holding frame body 7 is configured to be attached to and detached from a cooling device 6. The heat receiving member 61 of the cooling device 6 is structured to be joined with the holding frame body 7 via a sealing member 8. By means of the joining of the holding frame body 7 and the heat receiving member 61, sealed space is formed by a heat conducting surface 22 of the semiconductor chip 2, the holding frame body 7, and the heat receiving member 61. Inside the sealed space, liquid metal 5 is stored so that it may thermally connect to the heat conducting surface 22 of the semiconductor chip 2 and the inner wall bottom surface 612 of the heat receiving member 61, which faces the heat conducting surface. Consequently, the heat of the semiconductor chip is conducted to the heat receiving member 61 by the liquid metal 5. COPYRIGHT: (C)2010,JPO&INPIT