SEMICONDUCTOR CIRCUIT DEVICE

SEMICONDUCTOR CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To prevent the generation of wiring short-circuit due to a bridge between wirings which consist of copper (Cu), even in a semiconductor circuit device in which fine wiring is made. SOLUTION: By defining a maximum value of a wiring width 12 provided by a smallest space width 13...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: TAKAMI HITOSHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent the generation of wiring short-circuit due to a bridge between wirings which consist of copper (Cu), even in a semiconductor circuit device in which fine wiring is made. SOLUTION: By defining a maximum value of a wiring width 12 provided by a smallest space width 13 between adjacent wirings, the generation of wiring short-circuit due to the bridge between wirings which consist of copper (Cu) can be prevented even in the semiconductor circuit device in which fine wiring is made. COPYRIGHT: (C)2010,JPO&INPIT