SURFACE TREATMENT METHOD OF METAL, APPARATUS THEREOF, METHOD OF MANUFACTURING COPPER WIRE AND APPARATUS THEREOF

PROBLEM TO BE SOLVED: To provide a method for allowing a metal or copper wire to be subjected to cooling and reduction treatment without needing recovery treatment of a reaction product and treatment operation of an organic reducing agent and without contamination of environment. SOLUTION: This inve...

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Bibliographische Detailangaben
Hauptverfasser:	SAEKI TOMONORI, ANDO YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for allowing a metal or copper wire to be subjected to cooling and reduction treatment without needing recovery treatment of a reaction product and treatment operation of an organic reducing agent and without contamination of environment. SOLUTION: This invention relates to the surface treatment method, in which a liquid fluid 201 is brought into to contact with a surface of metal 101 to reduce an oxide film on the surface of the metal 101, wherein the liquid fluid 201 consists essentially of water and contains molecules of reductive gas of 1 to