SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a structure capable of easily confirming whether a probe trace reaches a bonding region in the case of a probing test without increasing the size of a semiconductor element. SOLUTION: The semiconductor device includes a first metal layer 26 provided on a semiconductor substrate, an insulating layer 30 provided on the first metal layer 26, and a second metal layer 33 provided on the insulating layer 30 and having electrode pad surfaces 33a and 33b that are exposed to the outside; in the second metal layer 33 and the insulating layer 30, a concave part 31 is formed; and on the concave part 31 of the insulating layer 30, the second metal layer 33 is provided. COPYRIGHT: (C)2010,JPO&INPIT