PACKAGE STRUCTURE OF PRESSURE SENSOR

PROBLEM TO BE SOLVED: To provide a package structure of a pressure sensor, capable of performing high accuracy pressure measurement, and also improving a package strength, particularly in addition to protection of a diaphragm. SOLUTION: The package structure of the pressure sensor includes, in its c...

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Bibliographische Detailangaben
1. Verfasser:	KIKUIRI KATSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a package structure of a pressure sensor, capable of performing high accuracy pressure measurement, and also improving a package strength, particularly in addition to protection of a diaphragm. SOLUTION: The package structure of the pressure sensor includes, in its constitution, a sensor 3 which has the diaphragm 9 arranged over a first cavity 8 and has piezoelectric elements B-E provided on the top of the diaphragm 9, a rigid cover 4 which is arranged over the sensor 3, forms a second cavity 16 between the diaphragm 9 and itself and has a vent 17, and a mold resin 5 which is provided on the lateral side of the sensor 3 over to the lateral side of the rigid cover 4 and further on the top 4c of the rigid cover 4, not covering the vent 17. COPYRIGHT: (C)2010,JPO&INPIT