MOLDING METHOD AND MOLDING DEVICE

PROBLEM TO BE SOLVED: To shorten a molding cycle, to make a facility compact, to save energy, and to reduce an environmental load, when manufacturing a molding. SOLUTION: Vent holes 14, 22 communicated with a molding die face are provided in an upper die 12 and a lower die 20 for heat compression of...

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Bibliographische Detailangaben
Hauptverfasser: YAMADA KENJI, MASUDA NAOHITO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To shorten a molding cycle, to make a facility compact, to save energy, and to reduce an environmental load, when manufacturing a molding. SOLUTION: Vent holes 14, 22 communicated with a molding die face are provided in an upper die 12 and a lower die 20 for heat compression of a molding material 18. The upper die 12 is constituted to be elevatable by an elevator 16 connected to an upper vessel 11, and the vent hole 14 thereof is connected to a blower 44 via a clearance 15 and a butterfly valve 42. A heat storage tank 26 is arranged in an under side of the lower die 20 via an openable and closable slide shutter 38. The slide shutter 38 is opened in heating, the slide shutter 38 is closed when finishing the heating, and the lower die 20 is elevated together with the upper die 12. Then, the blower 44 is turned on, outside air is taken in from the vent hole 22, and the molding material 18 is passed therein to be cooled. The upper die 12 is separated from the lower die 20 to take out the molding. COPYRIGHT: (C)2010,JPO&INPIT