METHOD FOR PRODUCING METAL PATTERN ON SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for forming a metal pattern of high fineness on a substrate at a cost as low as possible. SOLUTION: The method for forming the metal pattern on the substrate is characterized in that, first, an electroplating step 8 is executed after a polymerizing step 4 by...

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Bibliographische Detailangaben
Hauptverfasser: UELZEN THORSTEN, KRUSE JAN, ROSTAMI BARDIA, BECKER EIKE
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for forming a metal pattern of high fineness on a substrate at a cost as low as possible. SOLUTION: The method for forming the metal pattern on the substrate is characterized in that, first, an electroplating step 8 is executed after a polymerizing step 4 by a conductive polymer using a pattern electrode 2, and a removing step 16 of a polymer pattern is executed after a transfer step to a substrate of the metal pattern and/or a transfer step 12 to a substrate of the polymer pattern, thus solving the problem. COPYRIGHT: (C)2010,JPO&INPIT