MEMS STRUCTURES, METHODS OF FABRICATING MEMS COMPONENTS ON SEPARATE SUBSTRATES AND ASSEMBLY OF SAME

PROBLEM TO BE SOLVED: To provide a microelectromechanical device and a method of fabricating the microelectromechanical device. SOLUTION: Methods of fabricating an electrostatic interferometric modulation display devices and a device fabricated by the method are disclosed. In one embodiment, the ele...

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Bibliographische Detailangaben
Hauptverfasser:	FLOYD PHILIP DON, SAMPSELL JEFFREY BRIAN, GALLY BRIAN JAMES
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a microelectromechanical device and a method of fabricating the microelectromechanical device. SOLUTION: Methods of fabricating an electrostatic interferometric modulation display devices and a device fabricated by the method are disclosed. In one embodiment, the electrostatic interferometric modulation display devices are fabricated by laminating a front substrate and a backplate, each of which has components performed thereon. At least one of the front substrate and the back plate has a cavity having a depth selected for interferometric modulation. Features are formed by deposition and patterning, by embossing, or by patterning and etching. The methods not only reduce the manufacturing costs, but also provide a higher yield. COPYRIGHT: (C)2010,JPO&INPIT