RESIST MATERIAL AND METHOD FOR FORMING PATTERN USING THE SAME

PROBLEM TO BE SOLVED: To provide a method for forming a pattern having a good feature while decreasing roughness generating in a resist pattern. SOLUTION: A resist film 102 is formed on a substrate 101, and the formed resist film 102 is subjected to pattern exposure by selectively irradiating with e...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ENDO MASATAKA, SASAKO MASARU
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!