PROCESSING SHEET FOR SEALING OPTICAL SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide a processing sheet for sealing an optical semiconductor, by which optical semiconductors can be collectively sealed and the efficiency of light extraction can be increased, an optical semiconductor device sealed with the sheet, and a method of manufacturing an optica...

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Bibliographische Detailangaben
Hauptverfasser: AKAZAWA MITSUHARU, KIMURA RYUICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a processing sheet for sealing an optical semiconductor, by which optical semiconductors can be collectively sealed and the efficiency of light extraction can be increased, an optical semiconductor device sealed with the sheet, and a method of manufacturing an optical semiconductor device using the sheet. SOLUTION: The processing sheet for sealing an optical semiconductor includes a layer containing a sealing resin layer, in which an optical semiconductor device can be embedded, and an inorganic particle layer. The sealing resin layer is directly or indirectly stacked on the inorganic particle layer such that a substrate surface for mounting the optical semiconductor device comes into contact with the inorganic particle layer when the optical semiconductor device is embedded in the sealing resin layer and is sealed therein. COPYRIGHT: (C)2010,JPO&INPIT