MANUFACTURING METHOD FOR CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method for a circuit device which can hardly generate damage on a conductor section in a through-hole even if contact oil is not applied to a press-fit terminal. SOLUTION: In the manufacturing method for the circuit device having an element with the p...

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1. Verfasser: ISHII TETSUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method for a circuit device which can hardly generate damage on a conductor section in a through-hole even if contact oil is not applied to a press-fit terminal. SOLUTION: In the manufacturing method for the circuit device having an element with the press-fit terminal having a bar-shaped pointed head section, a contact section enlarging a diameter than the pointed head section, and a tapered section for connecting the pointed head section and the contact section, and a circuit board with the through-hole wherein the press-fit terminal is inserted and a conductive member come in contact with the contact section is prepared on an inner peripheral surface, the manufacturing method has a process of inserting the pointed head section and the tapered section into the through-hole at first inserting speed, and a process of inserting the press-fit terminal into the through-hole at second inserting speed slower than the first inserting speed after a part of the tapered section is inserted into the through-hole. COPYRIGHT: (C)2010,JPO&INPIT