EPOXY RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC PART DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulation, which is excellent in moisture-resistant adhesion and low-stress properties, and to provide an electronic part device which includes an element encapsulated with the same, and has a high reliability (moisture resistance a...

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Bibliographische Detailangaben
Hauptverfasser:	TSUCHIDA SATORU, KOSAKA MASAHIKO, OGATA MASAJI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulation, which is excellent in moisture-resistant adhesion and low-stress properties, and to provide an electronic part device which includes an element encapsulated with the same, and has a high reliability (moisture resistance and thermal-shock resistance). SOLUTION: The epoxy resin composition for encapsulation includes (A) a liquid epoxy resin, (B) a curing agent containing a liquid aromatic amine, (C) rubber particles, and (D) an inorganic filler. The electronic part device includes the element encapsulated with this epoxy resin composition for encapsulation. COPYRIGHT: (C)2010,JPO&INPIT