MOTHER BOARD FOR MULTIPLE WIRING BOARDS

PROBLEM TO BE SOLVED: To bring a cutting position close to the inner side edge of a common wire, in a mother board for which a branch wire branched from the common wire for plating at a peripheral margin part is connected to each terminal or the like so as to perform electroplating to the respective...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MAEHARA SHINJI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To bring a cutting position close to the inner side edge of a common wire, in a mother board for which a branch wire branched from the common wire for plating at a peripheral margin part is connected to each terminal or the like so as to perform electroplating to the respective terminals of wiring board parts arranged longitudinally and laterally and an electrical inspection is performed by loading an electronic component on the mother board whose branch wire is cut off along the inner side edge of the common wire for plating after the plating. SOLUTION: In the mother board wherein the branch wires 31 and 32 for plating branched from straight common wires 41 and 42 for plating are separately connected to the terminals 11 and 12 of the respective wiring board parts 10 and electroplating is executed, recessed parts 45 and 46 are formed at parts between the branch wires 31 and 32 or the like in the inner side edges 43 and 44 of the common wires 41 and 42. Even when the position of an actual cutting line is shifted outward from the inner side edges 43 and 44 of the common wires 41 and 42 for plating, since a short-circuit is prevented because there are the recessed parts 45 and 46, an error in cutting is largely tolerated. COPYRIGHT: (C)2010,JPO&INPIT