MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDER

PROBLEM TO BE SOLVED: To improve the quality of wire bonding by reducing the vibration of a lead frame or a wiring board after wire bonding. SOLUTION: A cooling blow piece 6s for cooling a wire-bonded matrix frame 2 to gradually lower its temperature is placed over a heat block 6b in a wire bonding...

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Hauptverfasser:	YAMAUCHI TOSHIHARU, AOKI MITSURU, MISUMI KAZUYUKI, SHINKAWA HIDEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the quality of wire bonding by reducing the vibration of a lead frame or a wiring board after wire bonding. SOLUTION: A cooling blow piece 6s for cooling a wire-bonded matrix frame 2 to gradually lower its temperature is placed over a heat block 6b in a wire bonding portion 6a of a wire bonder 6. By blowing cool air from the cooling blow piece 6s to the matrix frame 2 after wire bonding, the temperature of the matrix frame 2 is controlled to gradually lower the temperature of the wire-bonded matrix frame. Alternatively, the wire-bonded matrix frame 2 is fixed by means of a pressing jig tool such as a frame presser piece 6d, a guide member, a roller means or an elastic means until the wire-bonded matrix frame 2 is cooled completely. COPYRIGHT: (C)2010,JPO&INPIT