RESIN COMPOSITION, PREPREG AND LAMINATE

PROBLEM TO BE SOLVED: To provide a resin composition having excellent heat resistance, wherefrom a laminate having a small linear expansion coefficient in a thickness direction and good in adhesion to a conductor circuit, is obtainable; and to provide a prepreg and the laminate using the composition...

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Bibliographische Detailangaben
1. Verfasser:	TOBISAWA AKIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition having excellent heat resistance, wherefrom a laminate having a small linear expansion coefficient in a thickness direction and good in adhesion to a conductor circuit, is obtainable; and to provide a prepreg and the laminate using the composition. SOLUTION: The composition is used for forming the sheet-like prepreg by impregnation thereof to a substrate and is of characteristics in including an epoxy resin comprising a dicyclopentadiene type epoxy resin, dicyandiamide and an aromatic amino compound having one amino group in the molecule. The prepreg prepared by impregnating the composition to a substrate and the laminate formed with one or more of the prepreg, are also provided. COPYRIGHT: (C)2010,JPO&INPIT