SYSTEM AND METHOD FOR TREATING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method and a system for treating a substrate. SOLUTION: The system for treating a substrate includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatme...

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Bibliographische Detailangaben
Hauptverfasser:	HWANG SOOMIN, CHOI JINYOUNG, GO JAE SEUNG, KIMU DONHO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and a system for treating a substrate. SOLUTION: The system for treating a substrate includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a step for coating a protective layer on the wafer before an exposure step. The second module performs a step for cleaning the wafer and a post-exposure bake step after the exposure step. COPYRIGHT: (C)2010,JPO&INPIT