ADHESIVE FOR CORRUGATED BOARD

PROBLEM TO BE SOLVED: To provide a new adhesive for a corrugated board, which contains no formalin, gives excellent water-resistant adhesion, and has good viscosity stability. SOLUTION: The adhesive for the corrugated board is prepared by blending a water-resistant additive with an aqueous suspensio...

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Hauptverfasser: NOZAKI YOSHIHIKO, MIURA TOSHIHIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a new adhesive for a corrugated board, which contains no formalin, gives excellent water-resistant adhesion, and has good viscosity stability. SOLUTION: The adhesive for the corrugated board is prepared by blending a water-resistant additive with an aqueous suspension base which contains non-gelatinized starch to develop corrugated board top adhesion by heat gelation and gelatinized starch as a carrier component, wherein a polyamide epoxy resin is formulated as the water-resistant additive, and all or a portion of the gelatinized starch is substituted by natural thickening polysaccharide (except starch) which can be a food additive. COPYRIGHT: (C)2010,JPO&INPIT