MOLD STRUCTURE FOR HOT RUNNER

PROBLEM TO BE SOLVED: To provide a mold structure for hot runner free from the concern about resin leakage. SOLUTION: In a fixed mold 1, a cavity block 5 is fixed to a fixed mounting plate 3 via a spacer 4, a manifold 6 is arranged inside the cavity block and the fixed mounting plate, and a packing...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SHIMAZAKI YOJI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a mold structure for hot runner free from the concern about resin leakage. SOLUTION: In a fixed mold 1, a cavity block 5 is fixed to a fixed mounting plate 3 via a spacer 4, a manifold 6 is arranged inside the cavity block and the fixed mounting plate, and a packing 7 is arranged in the outlet side of a material passage 6a in the manifold. In a movable mold, a core block is fixed to a movable mounting plate. The mold structure comprises the fixed mold and the movable mold, wherein a molten resin material is introduced from a nozzle 16 into the material passage in the manifold and is charged from a hot nozzle 10 in the cavity block to a product cavity 11 formed between the core block and the cavity block. The manifold is arranged in a space 13 secured between the fixed mounting plate and the cavity block to absorb thermal expansion upon a temperature rise of the manifold, and the packing in the manifold side is elastically energized in the opening direction of the hot nozzle by interposing a regulation spring 15 between the manifold and the fixed mounting plate. COPYRIGHT: (C)2010,JPO&INPIT