SUBSTRATE FOR POWER MODULE WITH HEAT SINK, METHOD FOR MANUFACTURING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE

PROBLEM TO BE SOLVED: To provide: a substrate for a power module with a heat sink suppressing the occurrence of warpage; a method of manufacturing the same; a power module with a heat sink; and a substrate for a power module. SOLUTION: In the substrate 10 for a power module with a heat sink includin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAYASHI HIROMASA, ISHIZUKA HIROYA, KITAHARA JOJI, TONOMURA HIROSHI, KUROMITSU YOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!