SUBSTRATE FOR POWER MODULE WITH HEAT SINK, METHOD FOR MANUFACTURING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE

PROBLEM TO BE SOLVED: To provide: a substrate for a power module with a heat sink suppressing the occurrence of warpage; a method of manufacturing the same; a power module with a heat sink; and a substrate for a power module. SOLUTION: In the substrate 10 for a power module with a heat sink including: the substrate 11 for a power module formed with a circuit layer 13 on one surface of an insulation substrate 12, and formed with a metal layer 14 on the other face; and a heat sink 17 joined to the metal layer 14 side for cooling the substrate 11 for a power module, wherein the metal layer 14 is directly joined with the heat sink 17; and the ratio B/A of the thickness A of the circuit layer 13 to the thickness B of the metal layer 14 is set within the range of 2.167≤B/A≤20. COPYRIGHT: (C)2010,JPO&INPIT