SUBSTRATE FOR POWER MODULE WITH HEAT SINK, METHOD FOR MANUFACTURING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE

SUBSTRATE FOR POWER MODULE WITH HEAT SINK, METHOD FOR MANUFACTURING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE

PROBLEM TO BE SOLVED: To provide: a substrate for a power module with a heat sink suppressing the occurrence of warpage; a method of manufacturing the same; a power module with a heat sink; and a substrate for a power module. SOLUTION: In the substrate 10 for a power module with a heat sink includin...

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Hauptverfasser: HAYASHI HIROMASA, ISHIZUKA HIROYA, KITAHARA JOJI, TONOMURA HIROSHI, KUROMITSU YOSHIO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HAYASHI HIROMASA
ISHIZUKA HIROYA
KITAHARA JOJI
TONOMURA HIROSHI
KUROMITSU YOSHIO
description PROBLEM TO BE SOLVED: To provide: a substrate for a power module with a heat sink suppressing the occurrence of warpage; a method of manufacturing the same; a power module with a heat sink; and a substrate for a power module. SOLUTION: In the substrate 10 for a power module with a heat sink including: the substrate 11 for a power module formed with a circuit layer 13 on one surface of an insulation substrate 12, and formed with a metal layer 14 on the other face; and a heat sink 17 joined to the metal layer 14 side for cooling the substrate 11 for a power module, wherein the metal layer 14 is directly joined with the heat sink 17; and the ratio B/A of the thickness A of the circuit layer 13 to the thickness B of the metal layer 14 is set within the range of 2.167≤B/A≤20. COPYRIGHT: (C)2010,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUBSTRATE FOR POWER MODULE WITH HEAT SINK, METHOD FOR MANUFACTURING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE
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