METHOD OF MANAGING CUTTING BLADE

PROBLEM TO BE SOLVED: To provide a method of managing a cutting blade capable of cutting a wafer at a desired depth of cut if the temperature in a room where a cutting apparatus is installed. SOLUTION: In the method of managing the cutting apparatus including a chuck table; a cutting means for cutting the wafer; a cutting water supply means 56; a temperature controller 104 for controlling the temperature of the cutting water; a blade detection means for detecting wear of a cutting edge of the cutting blade; and a reference position detection means for detecting a reference position of the cutting blade, the method includes a temperature detection step of detecting a temperature 102 of the cutting water and a temperature 100 in the room; a reference position detection step of detecting the reference position of the cutting edge of the cutting blade; a reference position correction step of correcting the reference position of the cutting edge by detecting the amount of wear of the cutting edge and obtaining a difference from the reference position of the cutting edge; and a temperature control step in which the temperature controller controls the temperature of the cutting water when a room temperature different from the room temperature obtained during the execution of the reference position detection step is detected by performing the temperature detection step of detecting the cutting water temperature and the room temperature. COPYRIGHT: (C)2010,JPO&INPIT