COATED FLEXIBLE WIRING BOARD, LIQUID CRYSTAL DISPLAY MODULE, AND METHOD OF MANUFACTURING COATED FLEXIBLE WIRING BOARD

PROBLEM TO BE SOLVED: To provide a coated flexible wiring board equipped with coating layers on both principal surfaces, wherein the flexible wiring board has small repulsive force to swell outward even when a radius of bending is made small, and is superior in reliability, is suitably connected to...

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Bibliographische Detailangaben
Hauptverfasser:	MIURA KIMI, FUKUKAWA HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEALS SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a coated flexible wiring board equipped with coating layers on both principal surfaces, wherein the flexible wiring board has small repulsive force to swell outward even when a radius of bending is made small, and is superior in reliability, is suitably connected to a liquid crystal display panel of a liquid crystal display module and is used. SOLUTION: The coated flexible wiring board 1 includes: a flexible wiring board 2 having a base 2a made of a polyimide film and circuits 2b and 2c provided on both principal surfaces of the base 2a and connected together through a through-hole 2d; a coating layer 3 provided on one principal surface of the flexible wiring board 2 and made of a thermosetting resin composition; and a coating layer 4 provided on the other principal surface of the flexible wiring board and made of a photosensitive resin composition. COPYRIGHT: (C)2010,JPO&INPIT