ELECTRONIC COMPONENT COOLING STRUCTURE

PROBLEM TO BE SOLVED: To enhance the cooling performance, without increasing the size of cooling fins. SOLUTION: A vent hole 6 is formed in a base part 1 equipped with cooling fins 2. As cooling air is led into the adjacent cooling fins 2, equipped with an electronic component 5 through the vent hol...

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1. Verfasser:	SATO NOBUHIDE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	SATO NOBUHIDE
description	PROBLEM TO BE SOLVED: To enhance the cooling performance, without increasing the size of cooling fins. SOLUTION: A vent hole 6 is formed in a base part 1 equipped with cooling fins 2. As cooling air is led into the adjacent cooling fins 2, equipped with an electronic component 5 through the vent hole 6, the cooling performance of the electronic component 5 is improved without changing the size of the cooling fins 2. Furthermore, the vent hole 6 is formed across electronic components 4 and 5, thereby limiting a transfer of heat between the electronic components 4 and 5. Accordingly, the electronic components 4 and 5, that have different allowable temperatures, can be disposed on the same base part 1. COPYRIGHT: (C)2010,JPO&INPIT
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	ELECTRONIC COMPONENT COOLING STRUCTURE
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