ELECTRONIC COMPONENT COOLING STRUCTURE

ELECTRONIC COMPONENT COOLING STRUCTURE

PROBLEM TO BE SOLVED: To enhance the cooling performance, without increasing the size of cooling fins. SOLUTION: A vent hole 6 is formed in a base part 1 equipped with cooling fins 2. As cooling air is led into the adjacent cooling fins 2, equipped with an electronic component 5 through the vent hol...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SATO NOBUHIDE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To enhance the cooling performance, without increasing the size of cooling fins. SOLUTION: A vent hole 6 is formed in a base part 1 equipped with cooling fins 2. As cooling air is led into the adjacent cooling fins 2, equipped with an electronic component 5 through the vent hole 6, the cooling performance of the electronic component 5 is improved without changing the size of the cooling fins 2. Furthermore, the vent hole 6 is formed across electronic components 4 and 5, thereby limiting a transfer of heat between the electronic components 4 and 5. Accordingly, the electronic components 4 and 5, that have different allowable temperatures, can be disposed on the same base part 1. COPYRIGHT: (C)2010,JPO&INPIT