METHOD FOR MEASURING ULTRASONIC WAVE

PROBLEM TO BE SOLVED: To provide a method for measuring an ultrasonic wave capable of precisely measuring a thin layer (100 μm or below) in a material having a multi-layer structure. SOLUTION: In the method for measuring an ultrasonic wave, an object 20 to be measured having a plurality of interface...

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1. Verfasser:	KOMATSU SHINSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for measuring an ultrasonic wave capable of precisely measuring a thin layer (100 μm or below) in a material having a multi-layer structure. SOLUTION: In the method for measuring an ultrasonic wave, an object 20 to be measured having a plurality of interfaces is irradiated with an ultrasonic wave and to acquire waveforms of two reflection waves reflected by an upper-side interface and a lower-side interface of a measuring target layer of the object to be measured. The waveforms of the two reflection waves are compared with a reference waveform table having two or more kinds of reference waveforms formed beforehand so as to measure a thickness of the measuring target layer. COPYRIGHT: (C)2010,JPO&INPIT