ELECTRON GUN APPARATUS FOR ELECTRON BEAM VAPOR DEPOSITION
PROBLEM TO BE SOLVED: To provide an electron gun apparatus for electron beam vapor deposition which can easily perform a flattening operation for melt marks. SOLUTION: In the electron gun apparatus for electron beam vapor deposition composed in such a manner that an electron beam orbit is bent by a...
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creator | YAMASHITA KENICHI TAKASHIMA TOORU |
description | PROBLEM TO BE SOLVED: To provide an electron gun apparatus for electron beam vapor deposition which can easily perform a flattening operation for melt marks. SOLUTION: In the electron gun apparatus for electron beam vapor deposition composed in such a manner that an electron beam orbit is bent by a prescribed angle, it is emitted on a vapor deposition material 7 in a crucible 6, so as to melt the vapor deposition material 7, and the vapor of the vapor deposition material is deposited to the substrate to be vapor-deposited arranged at the upper part, so as to form a thin film, the apparatus is provided with: an electron beam orbit controlling means controlling an electron beam orbit by a deflecting coil 3 and an electron beam orbit by a scanning coil 5; and an incidence angle controlling means controlling the incidence angle of an electron beam 8 made incident on the vapor deposition material 7 by the electron beam orbit controlling means, and, by operating the electron beam orbit controlling means and the incidence angle controlling means, the melting degree of the vapor deposition material in the crucible 6 is equalized. COPYRIGHT: (C)2010,JPO&INPIT |
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SOLUTION: In the electron gun apparatus for electron beam vapor deposition composed in such a manner that an electron beam orbit is bent by a prescribed angle, it is emitted on a vapor deposition material 7 in a crucible 6, so as to melt the vapor deposition material 7, and the vapor of the vapor deposition material is deposited to the substrate to be vapor-deposited arranged at the upper part, so as to form a thin film, the apparatus is provided with: an electron beam orbit controlling means controlling an electron beam orbit by a deflecting coil 3 and an electron beam orbit by a scanning coil 5; and an incidence angle controlling means controlling the incidence angle of an electron beam 8 made incident on the vapor deposition material 7 by the electron beam orbit controlling means, and, by operating the electron beam orbit controlling means and the incidence angle controlling means, the melting degree of the vapor deposition material in the crucible 6 is equalized. COPYRIGHT: (C)2010,JPO&INPIT</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100729&DB=EPODOC&CC=JP&NR=2010163668A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100729&DB=EPODOC&CC=JP&NR=2010163668A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMASHITA KENICHI</creatorcontrib><creatorcontrib>TAKASHIMA TOORU</creatorcontrib><title>ELECTRON GUN APPARATUS FOR ELECTRON BEAM VAPOR DEPOSITION</title><description>PROBLEM TO BE SOLVED: To provide an electron gun apparatus for electron beam vapor deposition which can easily perform a flattening operation for melt marks. SOLUTION: In the electron gun apparatus for electron beam vapor deposition composed in such a manner that an electron beam orbit is bent by a prescribed angle, it is emitted on a vapor deposition material 7 in a crucible 6, so as to melt the vapor deposition material 7, and the vapor of the vapor deposition material is deposited to the substrate to be vapor-deposited arranged at the upper part, so as to form a thin film, the apparatus is provided with: an electron beam orbit controlling means controlling an electron beam orbit by a deflecting coil 3 and an electron beam orbit by a scanning coil 5; and an incidence angle controlling means controlling the incidence angle of an electron beam 8 made incident on the vapor deposition material 7 by the electron beam orbit controlling means, and, by operating the electron beam orbit controlling means and the incidence angle controlling means, the melting degree of the vapor deposition material in the crucible 6 is equalized. 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SOLUTION: In the electron gun apparatus for electron beam vapor deposition composed in such a manner that an electron beam orbit is bent by a prescribed angle, it is emitted on a vapor deposition material 7 in a crucible 6, so as to melt the vapor deposition material 7, and the vapor of the vapor deposition material is deposited to the substrate to be vapor-deposited arranged at the upper part, so as to form a thin film, the apparatus is provided with: an electron beam orbit controlling means controlling an electron beam orbit by a deflecting coil 3 and an electron beam orbit by a scanning coil 5; and an incidence angle controlling means controlling the incidence angle of an electron beam 8 made incident on the vapor deposition material 7 by the electron beam orbit controlling means, and, by operating the electron beam orbit controlling means and the incidence angle controlling means, the melting degree of the vapor deposition material in the crucible 6 is equalized. COPYRIGHT: (C)2010,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | ELECTRON GUN APPARATUS FOR ELECTRON BEAM VAPOR DEPOSITION |
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