TIN ELECTROPLATING SOLUTION AND TIN ELECTROPLATING METHOD

PROBLEM TO BE SOLVED: To provide a tin electroplating solution capable of obtaining a tin-plated film, which is less in chipped chaff under such a condition that tin-plated articles collide with each other during bulk mounting, is less in the mutual sticking of chip parts and is excellent in other p...

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Bibliographische Detailangaben
1. Verfasser:	ORIHASHI MASANORI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a tin electroplating solution capable of obtaining a tin-plated film, which is less in chipped chaff under such a condition that tin-plated articles collide with each other during bulk mounting, is less in the mutual sticking of chip parts and is excellent in other plating characteristics, and to provide a plating method for chip parts. SOLUTION: In the tin electroplating solution containing (1) stannous ions, (2) a complexing agent, (3) a nonionic surfactant and (4) an antioxidant, the tin electroplating solution for chip parts contains, as the nonionic surfactant, a compound represented by general formula (A): R-(C6H4)-RO(CH2CH2O)nH and a compound represented by general formula (B): HO-(C2H4O)l-(C3H6O)m-(C2H4O)n-H. COPYRIGHT: (C)2010,JPO&INPIT