METHOD AND APPARATUS FOR ELECTROCHEMICALLY MACHINING SUBSTRATE

PROBLEM TO BE SOLVED: To suitably control material removal from a substrate. SOLUTION: A method for electrochemically machining the substrate uses a conductive substrate (120) and a conductive tool (100) having a surface structure (130), machines the substrate using the tool through an electrochemic...

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Bibliographische Detailangaben
Hauptverfasser:	KLOPF FRANK, STOETZLER ARNO, KOBER JUERGEN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SEMICONDUCTOR DEVICES SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL TRANSPORTING WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To suitably control material removal from a substrate. SOLUTION: A method for electrochemically machining the substrate uses a conductive substrate (120) and a conductive tool (100) having a surface structure (130), machines the substrate using the tool through an electrochemical etching process and removes a material from a surface of the substrate based upon the surface structure of the tool through the etching process. In the method, the substrate and tool are moved relatively to each other during the electrochemical etching process. Further, an apparatus for electrochemically machining the substrate by the method is provided with a moving means of moving the substrate and tool relatively to each other during the electrochemical etching process. COPYRIGHT: (C)2010,JPO&INPIT