BLADE FOR DIVIDING SUBSTRATE AND SUBSTRATE DIVIDING METHOD

PROBLEM TO BE SOLVED: To provide a blade for dividing a substrate, along with a substrate dividing method, wherein clogging is suppressed to extend life. SOLUTION: The blade for dividing a substrate divides a printed board with electronic components formed thereon into the electronic components and...

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Bibliographische Detailangaben
Hauptverfasser:	IWAI YOZO, YAMAGUCHI HIROMASA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR MILLING PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a blade for dividing a substrate, along with a substrate dividing method, wherein clogging is suppressed to extend life. SOLUTION: The blade for dividing a substrate divides a printed board with electronic components formed thereon into the electronic components and a frame. A ceramic coating material 220 whose affinity with the materials of the printed board is low is formed on the surface of a blade part 210 where a blade is formed to cut the printed board. COPYRIGHT: (C)2010,JPO&INPIT