POLYAMIDEIMIDE RESIN INSULATING VARNISH AND INSULATED WIRE USING THE SAME

PROBLEM TO BE SOLVED: To provide a polyamideimide resin insulating varnish that has a high partial discharge inception voltage by achieving a low dielectric constant while maintaining the heat resistance, mechanical characteristics, oil resistance, etc., and an insulated wire using the same. SOLUTIO...

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Hauptverfasser:	KIKUCHI HIDEYUKI, YUKIMORI YUZO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polyamideimide resin insulating varnish that has a high partial discharge inception voltage by achieving a low dielectric constant while maintaining the heat resistance, mechanical characteristics, oil resistance, etc., and an insulated wire using the same. SOLUTION: In the polyamideimide resin insulating varnish obtained by dissolving a polyamideimide resin including no halogen element in the molecule chain, in a polar solvent, the polyamideimide resin is obtained by mixing an aromatic diisocyanate component (B) having two or less benzene rings with an aromatic imide prepolymer containing an aromatic diamine component (E) having, as a monomer, three or more benzene rings and an acid component comprising an aromatic tricarboxilic acid anhydride (C) and an aromatic tetracarboxylic acid dianhydride (D), and a ratio of M/N, wherein M is a molecular weight per repeating unit of the polyamideimide resin and N is an average number of the amide groups and imide groups, is 200 or more. COPYRIGHT: (C)2010,JPO&INPIT