BLASTING MEDIUM AND BLASTING METHOD

PROBLEM TO BE SOLVED: To provide a blasting medium that allows microfabrication of a workpiece without causing excessive damage or functional degradation, and is easily removable even if it remains on the workpiece. SOLUTION: The blasting medium is sprayed to a substrate 1 so as to remove smear 9 de...

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Bibliographische Detailangaben
Hauptverfasser:	HIRANO HACHIRO, TANAKA MASAHARU, YOSHIDA MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a blasting medium that allows microfabrication of a workpiece without causing excessive damage or functional degradation, and is easily removable even if it remains on the workpiece. SOLUTION: The blasting medium is sprayed to a substrate 1 so as to remove smear 9 deposited on the inside or the peripheral edge of each via hole 7. The blasting medium contains ≤5 mass% of particles having an average particle size of ≤20 μm and a particle size of ≥50 μm while including 90 mass% of a water-soluble inorganic salt. COPYRIGHT: (C)2010,JPO&INPIT