HIGH THERMAL-CONDUCTIVE, HALOGEN-FREE, FLAME-RETARDANT RESIN COMPOSITION, AND PREPREG AND COATING THEREOF

PROBLEM TO BE SOLVED: To provide a halogen-free, flame-retardant and high thermal-conductive resin composition for being applied to PCBs (printed circuit boards) so as to answer to the request of modern electronic products where compactness and integrity are required. SOLUTION: The high thermal-cond...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FENG DIANRUN, CHEN HAO-SHENG, LIAO TEAO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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