HIGH THERMAL-CONDUCTIVE, HALOGEN-FREE, FLAME-RETARDANT RESIN COMPOSITION, AND PREPREG AND COATING THEREOF

PROBLEM TO BE SOLVED: To provide a halogen-free, flame-retardant and high thermal-conductive resin composition for being applied to PCBs (printed circuit boards) so as to answer to the request of modern electronic products where compactness and integrity are required. SOLUTION: The high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal-conductive powder, and 0.01% to 10% of processing aids. COPYRIGHT: (C)2010,JPO&INPIT