HIGH THERMAL-CONDUCTIVE, HALOGEN-FREE, FLAME-RETARDANT RESIN COMPOSITION, AND PREPREG AND COATING THEREOF
PROBLEM TO BE SOLVED: To provide a halogen-free, flame-retardant and high thermal-conductive resin composition for being applied to PCBs (printed circuit boards) so as to answer to the request of modern electronic products where compactness and integrity are required. SOLUTION: The high thermal-cond...
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| creator | FENG DIANRUN CHEN HAO-SHENG LIAO TEAO |
| description | PROBLEM TO BE SOLVED: To provide a halogen-free, flame-retardant and high thermal-conductive resin composition for being applied to PCBs (printed circuit boards) so as to answer to the request of modern electronic products where compactness and integrity are required. SOLUTION: The high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal-conductive powder, and 0.01% to 10% of processing aids. COPYRIGHT: (C)2010,JPO&INPIT |
| format | Patent |
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SOLUTION: The high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal-conductive powder, and 0.01% to 10% of processing aids. 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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | HIGH THERMAL-CONDUCTIVE, HALOGEN-FREE, FLAME-RETARDANT RESIN COMPOSITION, AND PREPREG AND COATING THEREOF |
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